Beckermus Technologies Revenue
Appliances, Electrical, and Electronics Manufacturing • 
Hof HaCarmel Regional Council, Haifa District, Israel • 1-10 Employees
Beckermus Technologies revenue & valuation
| Annual revenue | $769,995 |
| Revenue per employee | $86,000 |
| Estimated valuation?This valuation is estimated based on industry average for the Appliances, Electrical, and Electronics Manufacturing industry and current estimated revenues | $2,500,000 |
| Total funding | No funding |
Key Contact at Beckermus Technologies
Aviv Ronen
Chief Technology Officer
Company overview
| Headquarters | Hof HaCarmel Regional Council, Haifa District, Israel |
| Phone number | +9723088900 |
| Website | |
| NAICS | 334 |
| SIC | 367 |
| Keywords | SIP, Mems, Encapsulation, Microelectronics, Flip Chip, MCM, Wirebonding, Active Alignment, Chip On Board, Ic Packaging, Micro-Optics, Micro Assembly, Microelectromechanical Systems (Mems) Assembling, Photonics Assembly, Wire Bonding, Wafer Level Packaging, Chip On Flex, Diode Assembly, Prism Assembly, Bare Die Assembly, Lenses Assembly, Stacked Dies Assembly, Die Attach |
| Founded | 1998 |
| Employees | 1-10 |
| Socials |
Beckermus Technologies Email Formats
Beckermus Technologies uses 2 email formats. The most common is {first initial} (e.g., j@beckermus.com), used 62.5% of the time.
| Format | Example | Percentage |
|---|---|---|
{first initial} | j@beckermus.com | 62.5% |
{first name} | john@beckermus.com | 37.5% |
About Beckermus Technologies
Beckermus Technologies was founded in 1998 by the Beckermus brothers: Oded and Oren. The founders’ vision was to create an Excellence Center in the field of "Bare Die" assembly services. The company has evolved alongside growth of the local startup community and expansion of global corporate activity in Israel. Our versatile client base (from R&D/NPI to High Volume production) has optimally qualified us for a worldwide expansion. Beckermus services are currently available globally, consistently featuring our 3 main fundamental values: high quality, quick response and reasonable pricing. Prototyping and low-medium volume production is performed at our 750 sqm cleanroom facility. Mass production is performed at our partners’ facilities in the far-east and in Europe receiving our full support and professional liability. Our main services: Wire bonding, Encapsulation, Active Alignment, IC packaging, 3D stacked dies, Electro optics and photonics assembly, Die attach, Wafer dicing/sorting, Chip on board/Chip on flex, Flip Chip, Wafer level packaging, SiP and MCM. Our quality standards certifications: - ISO 13485: Medical devices - IPC-A-610 - AS9100D aerospace - MILL-STD 883 - QMS certified
Employees by Management Level
Total employees: 1-10
Seniority
Employees
Employees by Department
Beckermus Technologies has 5 employees across 3 departments.
Departments
Number of employees
Funding Data
Beckermus Technologies has never raised funding before.
Beckermus Technologies Tech Stack
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