Boschman Advanced Packaging Technology Revenue
Semiconductor Manufacturing • 
Duiven, Gelderland, Netherlands • 51-100 Employees
Boschman Advanced Packaging Technology revenue & valuation
| Annual revenue | $7,272,175 |
| Revenue per employee | $86,000 |
| Estimated valuation?This valuation is estimated based on industry average for the Semiconductor Manufacturing industry and current estimated revenues | $23,300,000 |
| Total funding | No funding |
Key Contacts at Boschman Advanced Packaging Technology
Eef Boschman
Managing Director At Boschman Advanced Packaging Technologies
Jae Young Kim
Account Director East Asia
Company overview
| Headquarters | Stenograaf 3, Duiven, 6921EX, NL |
| Phone number | +31263194900 |
| Website | |
| NAICS | 333242 |
| Keywords | Package Development, Power Modules, Transfer Molding, Mems & Sensors, Ag Sintering |
| Founded | 1987 |
| Employees | 51-100 |
| Socials |
Boschman Advanced Packaging Technology Email Formats
Boschman Advanced Packaging Technology uses 3 email formats. The most common is {first name}{last name} (e.g., johndoe@boschman.nl), used 78% of the time.
| Format | Example | Percentage |
|---|---|---|
{first name}{last name} | johndoe@boschman.nl | 78% |
{first initial}{last name} | jdoe@boschman.nl | 22% |
About Boschman Advanced Packaging Technology
Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.
Employees by Management Level
Total employees: 51-100
Seniority
Employees
Employees by Department
Boschman Advanced Packaging Technology has 47 employees across 7 departments.
Departments
Number of employees
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