


JIACO Instruments
Semiconductors • Delft, South Holland, Netherlands • 11-20 Employees
Company overview
| Headquarters | Feldmannweg 17, Delft, South Holland 2628, NL |
| Phone number | +31625261648 |
| Website | |
| SIC | 367 |
| Keywords | Ag, Cu, Underfill, FOW, 3D Stacked Die Package Decapsulation, Led Package Decapsulation, Advanced Ic Package Decapsulation, Au Wire Decapsulation, Copper Wire Decapsulation, Eos Exposure, O2 Only Plasma Decapsulation, Pdcu, Plasma Decapsulation Systems, Saw Baw Filter Decapsulation, Sip & Module Decapsulation, Silver Wire Decapsulation, Thermally Stressed Package Decapsulation, Die Attach Etching |
| Founded | 2014 |
| Employees | 11-20 |
| Socials |
Key Contacts at JIACO Instruments
Kees Beenakker
Co-Founder And Member Advisory Board
Mark Mckinnon
Sales Director
Jing Wang
Systems Development Director
JIACO Instruments Email Formats
JIACO Instruments uses 2 email formats. The most common is {first initial} (e.g., j@jiaco-instruments.com), used 72.7% of the time.
| Format | Example | Percentage |
|---|---|---|
{first initial} | j@jiaco-instruments.com | 72.7% |
{first name} | john@jiaco-instruments.com | 27.3% |
About JIACO Instruments
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control. Our application range includes: - HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages - Silver wire packages (new) - Wafer Level Chip Scale Package (WLCSP) (new) - High Tg mold compound (new) - Film Over Wire (FOW) (new) - Chip on Board (new) - Electrical Overstress (EOS) failure sites - Surface contamination and corrosion - Wedge bonds exposure - 3D stacked-die IC package - Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices (new) - System in Package (SiP) (new) - Localized decapsulation (new) - Sensors with transparent mold compound (new) - Bond Over Active Circuit (BOAC) with exposed copper metallization (new) - Redistribution Layer (RDL) with PBO and copper metallization (new) Other applications under R&D
JIACO Instruments revenue & valuation
| Annual revenue | $1,112,215 |
| Revenue per employee | $86,000 |
| Estimated valuation?This valuation is estimated based on industry average for the Semiconductors industry and current estimated revenues | $3,600,000 |
| Total funding | No funding |
Employees by Management Level
Total employees: 11-20
Seniority
Employees
Employees by Department
JIACO Instruments has 9 employees across 4 departments.
Departments
Number of employees
Funding Data
JIACO Instruments has never raised funding before.
JIACO Instruments Tech Stack
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Frequently asked questions
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